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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 4 July 2016
Phison set to post another year of record sales, says report
Consolidated revenues at NAND flash device controller supplier Phison Electronics are expected to register another sequential increase in 2016 after climbing to a record NT$37.18...
Monday 4 July 2016
Digitimes Research: China IC production value to rise 15% in 2016
China's IC industry production value is forecast to rise 15% to US$66.64 billion in 2016, according to Digitimes Research.
Friday 1 July 2016
Robust SSD demand to buoy related IC revenues in 3Q16
Robust SSD demand will buoy related IC suppliers' revenues in the third quarter of 2016. Companies including Phison Electronics, Silicon Motion Technology and Realtek Semiconductor...
Friday 1 July 2016
Rambus to acquire memory business from Inphi
Rambus announced on June 30 it has signed a definitive agreement to purchase the memory interconnect business from Inphi for US$90 million in cash. The acquisition includes all assets...
Friday 1 July 2016
Notebook-related IC suppliers expect to enjoy double-digit revenue growth in 3Q16
Notebook-related IC suppliers expect to see revenues grow over 10% sequentially in the third quarter of 2016, according to industry sources.
Friday 1 July 2016
TSMC discloses NT$4.4 billion worth of facility construction for Nanjing site
Taiwan Semiconductor Manufacturing Company (TSMC) has spent NT$4.4 billion (US$136.7 million) on factory building construction with China Construction First Division Group Construction...
Friday 1 July 2016
ASE, SPIL sign merger deal
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) jointly announced on June 30 they have officially entered into a merger agreement reached on May...
Thursday 30 June 2016
ASE buys equipment from Teradyne
Packaging and testing company Advanced Semiconductor Engineering (ASE) has purchased equipment from automated test equipment supplier Teradyne for a total of NT$625.95 million (US$19.37...
Thursday 30 June 2016
Qualcomm Snapdragon 600 and 800 processors to support Google Tango
Qualcomm has announced that it will expand support for Tango technology to Snapdragon 820 and to future Snapdragon 800 and 600 tier processors.
Thursday 30 June 2016
MediaTek joins China Mobile 5G project
MediaTek has announced its participation in China Mobile's 5G Joint Innovation Center project.
Thursday 30 June 2016
TSMC orders equipment for NT$3 billion
Taiwan Semiconductor Manufacturing Company (TSMC) has announced purchases of manufacturing equipment and facilities totaling NT$3.05 billion (US$94.4 million) from Tokyo Electron,...
Wednesday 29 June 2016
Industry integration, 5G and IoT applications: Q&A with Qualcomm president Derek Aberle
Qualcomm president Derek Aberle spared his time with Digitimes for an exclusive interview recently and shared his insights into a number of major issues facing the global...
Wednesday 29 June 2016
Qualcomm eyes future roll out of 5G SoC solutions
Qualcomm aims to roll out the world's first 5G SoC solution, as 3GPP (3rd Generation Partnership Project) is expected to finalize 5G technology standards sometime in 2018, according...
Wednesday 29 June 2016
Fingerprint sensor startup raises nearly NT$200 million
Eminent Electronic Technology, an Elan Microelectronics subsidiary specializing in the design of fingerprint sensors, has completed a capital increase by raising nearly NT$200 million...
Wednesday 29 June 2016
Egistec seeing strong fingerprint sensor orders through end-2016
Fingerprint sensor supplier Egis Technology (Egistec) expects to enjoy strong orders through the end of 2016. Egistec has obtained new orders from a South Korea-based customers, and...