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IN THE NEWS
Tuesday 23 February 2016
Several Taiwan IC design houses ready for virtual reality boom
Etron Technology, Elan Microelectronics and C-Media Electronics are already engaged in the development of chips for virtual reality (VR) devices gearing up for the market boom. However,...
Tuesday 23 February 2016
MediaTek expands wearables portfolio with MT2511 for health and fitness devices
MediaTek has announced the MT2511, the company's first bio-sensing analog front-end (AFE) chip designed for health and fitness devices. The MT2511 enables bio signal acquisition through...
Monday 22 February 2016
ASE, KYEC make equipment purchases
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and King Yuan Electronics (KYEC) have both announced equipment purchases via their respective company filings...
Monday 22 February 2016
Huawei introduces its first PC powered by Intel chips
At the ongoing Mobile World Congress (MWC) 2016, Huawei has unveiled its first ever PC, the Huawei Matebook, which is a 2-in-1 device powered by a sixth-generation Intel Core m-series...
Monday 22 February 2016
MediaTek expands flagship mobile-SoC lineup
The MediaTek Helio P20 system-on-chip has been announced as the latest addition to the company's top-tier Helio family of mobile processors.
Friday 19 February 2016
Digitimes Research: Qualcomm to lead AP market in 2016, Intel to show strongest growth
The global application processor (AP) market will grow 8.5% in 2016, reaching 1.78 billion units, according to a recent Digitimes Research Special Report. The growth rate in 2016...
Friday 19 February 2016
Utilization rates rise at 8-inch fabs in China and Taiwan
Capacity utilization rates at 8-inch fabs in China and Taiwan have risen sharply since the first quarter of 2016 thanks mainly to a pull-in of orders for fingerprint sensors and large-size...
Friday 19 February 2016
Qualcomm and Lenovo sign 3G/4G patent license agreement
Qualcomm and Lenovo have announced that they have entered into a new 3G and 4G patent license agreement for China, which covers devices marketed by both Motorola and Lenovo.
Friday 19 February 2016
Flexible PCB companies bracing for price war
With China-based Suzhou Dongshan Precision Manufacturing (DSBJ) looking to acquire US-based Multi-Fineline Electronix (MFLEX), a price war is likely to take place in the worldwide...
Thursday 18 February 2016
iPhone chip suppliers start booking capacity
Chip suppliers of Apple's next-generation iPhone-series have started to book production capacity at their foundry and backend partners, according to industry sources.
Thursday 18 February 2016
TPMS player Cub Elecparts chairman expects good 2016 performance
Taiwan-based tire pressure monitoring system (TPMS) player Cub Elecparts is able to ship 2.4-2.6 million tire sensors per year, but compared to the worldwide annual shipments of at...
Thursday 18 February 2016
Taiwan IC design houses look to short lead-time orders in March-April
Demand for smartphone-, tablet- and other mobile device-related chips is unlikely to gain any momentum until the end of March or early April when clients start placing short-lead...
Thursday 18 February 2016
Samsung launches 14nm SoC for mid-range smartphones
Samsung Electronics has announced the newest member of its Exynos 7 Octa processor line-up, the Exynos 7 Octa 7870. Using the company's 14nm FinFET process technology, the Exynos...
Wednesday 17 February 2016
Panel makers and ODMs benefit from rising orders for Asustek high-end notebooks
As competition in the high-end notebook market is expected to start heating up, Asustek Computer has been increasing its orders for high-end notebook models, benefiting its component...
Wednesday 17 February 2016
Leadcore 28nm SoC ready for production at SMIC
Semiconductor Manufacturing International (SMIC) and Leadcore Technology have jointly announced that SMIC's 28nm HKMG process will be ready for mass production for Leadcore's smartphone...