China is stepping up the development of homegrown EDA (electronic design automation) software and systems as part of its efforts to boost self-sufficiency in semiconductor, and many...
Ahead of the new US trade sanctions against Huawei taking effect on September 15, Hannstar had geared up its handset panel shipments to the Chinese vendor, which helped boost Taiwan's...
Smartphone application processor shipments to China-based vendors amounted to 192.6 million units in third-quarter 2020, up 13.4% quarter-over-quarter and down 9.5% year-over-year.
Taiwan's top OSAT firm ASE Technology will hike backend service quotes by 5-10% starting first-quarter 2021 to reflect increased cost and tight capacity supply for some products,...
The US trade sanctions against Huawei and its chipmaking affiliate HiSilicon continue to benefit Taiwan's IC design sector in the fourth quarter of 2020, set to be a particularly...
With prospects for 5G infrastructure construction in China remaining uncertain, Taiwan's CCL makers in the supply chain for 5G base stations may have to rely more on shipment momentum...
Backend house ShunSin Technology, a subsidiary of Foxconn Technology, is set to start commercial production at its new plants in Vietnam 2021, mainly to fulfill orders from US clients,...
Smartphone shipments to the China market in third-quarter 2020 plunged 25.2% on quarter and 26.2% on year due to the US government placing stricter trade sanctions on Huawei and consumer...
Honor may become a successful handset brand on its own after being spun off from Huawei, but faces challenges by becoming a competitor of its ex-parent company, according to industry...
Huawei has decided to sell its Honor brand smartphone business unit to a Chinese government-backed consortium, hiving off the entry-level handset arm to ensure the survival of its...
IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...
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