Samsung Electronics Executive Chairman Lee Jae-yong returned to South Korea on July 14 following a whirlwind trip to the exclusive Sun Valley Conference in Idaho, marking his fourth publicly disclosed overseas trip of 2025. With each of his international visits increasingly tied to strategic business talks and next-generation growth sectors, industry watchers are closely tracking what may emerge from his latest excursion.
As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.
As demand surges for AI, HPC, and high-speed communications, the PCB industry is entering a new phase of advanced innovation. Chinese PCB manufacturers are aggressively moving into the AI server and HDI segments, seizing the opportunity through technical breakthroughs, expanded capacity, and ambitious market expansion.
