Yageo Corp. officially launched a public tender offer for Shibaura Electronics on May 9, 2025. Shibaura, a globally recognized manufacturer of negative temperature coefficient (NTC) thermistors, is noted for its strong technical capabilities.

Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification. Key suppliers involved in early development include Taiwan's Zhen Ding Technology Holding, Unimicron Technology Corp., and Compeq Manufacturing Co., along with China's WUS Printed Circuit (Kunshan) Co. and Victory Giant Technology (HuiZhou) Co.

Taiwan Chelic, a pneumatic components maker, is positioning itself as a new entrant in Taiwan's humanoid robot supply chain with its in-house development of a bionic hand, which has already been sampled to domestic clients. The company plans to move further into subsystems by developing dexterous robotic hands with integrated joint modules.

South Korea's Doosan Corporation Electro-Materials is significantly increasing its investment in copper-clad laminate (CCL) equipment amid growing competition from Taiwanese suppliers. According to a report by South Korean outlet ZDNet Korea citing industry sources, the company's capital expenditure for 2025 is expected to more than triple from 2024, reaching approximately KRW86.4 billion (US$62 million).

AI servers have become a key growth driver for the global printed circuit board (PCB) industry. Companies specializing in advanced packaging IC substrates and high-layer count, high-density rigid boards are the primary beneficiaries. However, not all PCB product lines benefit equally.

Traditional glass manufacturer Taiwan Glass has invested its resources in AI fiberglass cloth, successfully transforming and penetrating the AI server supply chain led by Nvidia to evolve into a key materials manufacturer for CoWoS substrate boards.

Intel is reportedly preparing to license its glass core substrate (GCS) technology, reversing course from its earlier plan to commercialize the technology in-house. The pivot could turn Intel from a prospective supplier into a customer, opening opportunities for Samsung Electro-Mechanics (Semco) and Absolics Inc.

The acquisition contest for Japan's NTC thermistor manufacturer Shibaura Electronics is approaching its conclusion, with the final outcome now dependent solely on regulatory approval, reports Nikkei.

Samsung Electro-Mechanics (Semco) has recently adjusted its IC substrate supply chain, appointing Mitsubishi and Resonac as the primary suppliers for key materials such as copper-clad laminates (CCL). Industry observers view the move as a response to changes in Semco's advanced build-up film (ABF) substrate business.

The United States' implementation of trade protectionism has introduced significant uncertainty and risks for export-oriented economies. Chin-Ching Liu, minister of the National Development Council (NDC), recently announced that to enable Taiwan's small and medium-sized enterprises (SMEs) to scale up their investments in the US and avoid high tariffs, the government will amend laws to offer tax incentives encouraging businesses to form industrial holding companies as a strategic step toward entering the US market.

Heron Neutron Medical, a subsidiary of semiconductor equipment supplier Hermes-Epitek, is set to list on Taiwan's stock market in mid-September. Heron General Manager Leo Shen stated that by integrating patented technologies from National Tsing Hua University and Taiwan's Industrial Technology Research Institute (ITRI), the company has developed a patented accelerator-based boron neutron capture therapy (AB-BNCT) device for cancer treatment. This device received medical device certification in 2024, making Heron the first certified manufacturer in Taiwan and the second worldwide.

Following Yageo's announcement on August 21, 2025, that it has increased its tender offer bid (TOB) for Shibaura Electronics to JPY6,635 (US$44.64) per share, up from JPY6,200, Japanese competitor MinebeaMitsumi declared it will not raise its offer beyond JPY6,200 per share, report Nikkei and Reuters.

Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach could significantly impact the semiconductor packaging supply chain, especially within the PCB industry.

Taiwan-based passive components giant Yageo announced it has increased its tender offer price for Japan's negative temperature coefficient (NTC) thermistor manufacturer Shibaura Electronics. The offer price was raised from JPY6,200 (US$41.86) per share to JPY6,635 per share, surpassing the expectations of competitor MinebeaMitsumi.

The artificial intelligence boom is driving sharp demand growth across the printed circuit board (PCB) materials chain, pushing both prices and volumes higher. Supply pressure is no longer limited to low-CTE fiberglass fabrics used in CoWoS substrates; shortages are now spreading to low-Dk fiberglass fabrics for copper-clad laminates (CCL), high-volume-low-profile (HVLP) copper foil, and coated microdrills required for PCB drilling.

Kinsus Interconnect Technology, a unit of Pegatron, challenged market fears of a looming IC substrate shortage, arguing supply of both ABF and BT substrates still exceeds demand. Only high-layer ABF substrates, fueled by AI server and high-performance computing orders, are expected to reach balance by 2026, a stance at odds with rivals Zhen Ding Technology and Unimicron Technology.

Zhen Ding Technology, the world's largest printed circuit board (PCB) manufacturer, announced that its Chinese subsidiary, Avary Holding, has approved a major investment plan for its Huaian campus. The company will invest CNY8 billion (approximately US$1.1 billion) between the second half of 2025 and 2028 to expand high-end PCB production capacity, targeting the fast-growing demand driven by artificial intelligence applications.

The acquisition contest for Shibaura Electronics, a maker of negative temperature coefficient (NTC) thermistors, has intensified as Minebea Mitsumi and Taiwan's Yageo Corporation have matched bids of JPY6,200 (US$41.95) per share. Both firms are vying to secure control amid strategic industry significance.

China's copper-clad laminate (CCL) producers, pressured by surging raw material costs and intensifying competition, have issued new price increase notices. Kingboard, Meizhou Weilibang Electronic Technology, and Jiangxi Hongruixing are among the first to move, prompting expectations that Taiwanese counterparts may follow with adjustments in mid- and low-end materials.

Nan Pao Resins Chemical Group has been expanding into the semiconductor sector, with an eye on semiconductor adhesives and other electronic applications driving growth. Following its merger with Yunteh Industries, Nan Pao expects record-high revenue for 2025 even amid the turbulent economy this year.

Taiwan-based ASIC design firm Intelligo Technology, which specializes in AI-powered acoustics and speech recognition, posted solid gains in the second quarter of 2025 as consumer electronics demand picked up. The company booked consolidated revenue of NT$349 million (US$10.8 million), up 12.4% from the prior quarter and 94.7% year-over-year.

Taiwan's Yageo Corporation has extended the deadline for its tender offer bid (TOB) for Japan's Shibaura Electronics to August 28 amid a competitive price increase from rival MinebeaMitsumi. Both companies are vying for control of the negative temperature coefficient (NTC) thermistor manufacturer.

As China's semiconductor juggernaut gathers pace, a fierce contest for dominance in the silicon wafer market is becoming inevitable for global suppliers.

Topco Scientific (TSC) stated during an earnings call on August 14, 2025, that current semiconductor market conditions are on par with the first quarter of 2025, adding that advanced processes continue to grow, while demand for the mature 28nm process gradually recovers.

Despite TSMC's US$165 billion investment in the US, Taiwan does not appear to have any special favor from the United States. Taiwan faces a higher reciprocal tariff compared to Japan and South Korea, and US President Donald Trump has even threatened to impose a 300% tariff on semiconductors. However, companies that already have factories or plan to build them in the US are exempted.