Leading PCB manufacturer Zhen Ding has received approval to set up an AI park at the Southern Taiwan Science Park. The company is expected to invest NT$2 billion (US$61 million) to establish a hardboard production line and R&D center, targeting high-end PCB demands from clients in the AI server sector, with production anticipated to commence in the second half of 2025 at the earliest.
Taiwan's major motherboard and graphics card manufacturers are capitalizing on opportunities in the AI server sector, with projected operational growth in 2025, according to industry sources.
South Korea's Ministry of Trade, Industry, and Energy (MOTIE) has announced a KRW36.4 billion (US$24.79 million) investment to fund 48 next-generation semiconductor R&D projects by 2025. The initiative focuses on Processing-In-Memory (PIM) chips, advanced packaging, on-device AI semiconductors, system semiconductors, and compound power semiconductors.
Japanese printed circuit board (PCB) manufacturer Meiko has doubled its market value, driven by the need for the global supply chain relocation away from China. By proactively setting up production facilities in Vietnam, Meiko has become a key player amidst the US-China tensions. Satellite communications opportunities have also significantly boosted its revenue growth.
A recent report has revealed that the CPU department under Arm China, a Chinese chip IP designer and service provider, has started laying off employees. The department consists of around 30-40 staff members. Even though the number of layoffs is not large, it still has a significant impact on Arm China given the scale of the company.
Wingtech, a Chinese ODM and IDM powerhouse, announced on December 30 that it has signed a letter of intent to transfer the equity and operating assets of nine ODM subsidiaries to Luxshare Precision Industry. This acquisition would mark a watershed moment in the supply chain landscape.
Elephantech Inc., a Tokyo-based printed electronics manufacturer, has announced a breakthrough in developing general-purpose multilayer printed circuit boards (PCBs). The company's press release claims its proprietary SustainaCircuits™ technology is poised to revolutionize the industry by significantly reducing copper usage and production costs.
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market will only see mild recovery, with the automotive market unlikely to see improvements.
Chinese microcontroller unit (MCU) manufacturers are ramping up their presence in the edge AI sector, following the trajectory of global leaders in AI MCU development.
Hyundai Motor Group has reportedly disbanded its Semiconductor Strategy Group (the Group), a key division tasked with driving the company's in-house development of automotive semiconductors to reduce reliance on external suppliers. Its functions and personnel are being reassigned to other departments as part of a broader restructuring.
Nan Ya PCB, one of Taiwan's top trio of substrate manufacturers, has capitalized on a strategic opportunity in the latter half of 2024 by launching new high-end substrate products to drive its business transformation and capture a share of the burgeoning AI and high-performance computing (HPC) markets. The company forecasts double-digit revenue growth by 2025.
Topoint Technology, a manufacturer of PCB drill bits, is preparing to commence mass production at its new factory in Thailand in 2025. This facility will provide drilling services to local PCB operations overseen by Taiwan-based companies.
Automotive PCB manufacturer Chin Poon is maintaining a cautious outlook for 2025, projecting flat market conditions amid the global automotive market slowdown and client pessimism. With market recovery uncertain, the company plans to strategically expand its focus on communications and industrial control segments in the coming year.
Amid shifting dynamics in the power semiconductor market, Onsemi is leveraging China as a key growth driver for its dual focus on automotive electrification and AI data centers. Celebrating its 25th anniversary, the company is laying the groundwork for long-term growth.
Following other PCB firms' expansion moves, niche copper-clad laminate (CCL) specialist Ventec announced plans in November for a production base in Thailand, which will begin volume production in the first quarter of 2026. The expansion comes in consideration of escalating risks in the US-China trade war, aiming to enhance the company's long-term resilience through a production base in Southeast Asia.
In a press release dated December 10, Toppan, a subsidiary of Toppan Holdings, announced its participation in the US-JOINT initiative. This initiative is a consortium between the US and Japan, which was established in July with the goal of advancing AI and autonomous technology in next-generation semiconductor packaging.
Taiwan-based tier-1 high-density interconnect (HDI) board maker Compeq Manufacturing has opened its first production base in Southeast Asia located in Thailand. The facility will initially focus on producing printed circuit boards (PCB) for low-earth orbit (LEO) satellites with mass production set to begin in the first quarter of 2025.
Japanese semiconductor testing equipment firm Advantest has announced its latest testing solutions for advanced applications such as high-end memory, 5G, AI, and high-performance computing (HPC). The company is also closely monitoring Rapidus's progress in mass-producing 2nm chips.
Taiwan-based HDI board manufacturer Compeq experienced robust revenue performance in November, driven by the heightened demand for tablets and notebooks, steady shipments of low Earth orbit (LEO) satellites, and substantial orders for new models from Chinese mobile phone manufacturers.
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead frames and fan-out panel-level packaging (FOPLP) for gallium nitride (GaN) power semiconductor components and emerging applications, targeting opportunities in AI servers, automotive electronics, and new energy power management. Phoenix Pioneer is optimistic about turning the corner on losses and emerging from its trough by 2025.
Taiwan's National Center for High-Performance Computing (NCHC) unveiled its "Printed Circuit Board Assembly (PCBA) Cloud Analysis Platform" at a press conference on December 10. The new platform aims to address the electronics industry's challenges in ensuring the reliability, longevity, and precision of printed circuit board assemblies (PCBA).
Onsemi announced on December 9, 2024, that it has agreed to acquire Qorvo's Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, for US$115 million in cash. The strategic acquisition will complement Onsemi's extensive EliteSiC power portfolio and enable the company to address growing demands for high energy efficiency and power density in the AC-DC stage of power supply units for AI data centers.
Despite the low profitability of SK Hynix's CMOS image sensor (CIS) business, the company has decided to retain this segment and reorganize its CIS development team under the Future Technology Research Institute, possibly hoping to replicate the successful narrative seen in high bandwidth memory (HBM).
Smartphone shipments underperformed in the second half of 2024, particularly with Android momentum in China slowing compared with the first half of the year. As a result, Taiwanese power amplifier (PA) supply chain players have experienced weak performance in the past two quarters, pushing related players to focus on developing low-Earth orbit (LEO) satellite products.
