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Trends in industrial computing
Digitimes trackes the latest trends in industrial computing applications, including IoT, Industry 4.0 and automation and robotics.
IN THE NEWS
Monday 21 January 2019
MOSFET backend specialist GEM to enjoy another year of record revenues
Backend house GEM Services, which specializes in packaging services for semiconductor power devices, is expected to enjoy another year of record-high revenues in 2019 thanks to robust...
Monday 21 January 2019
Eureka Park: With IoT devices coming into shape, startup teams target niche markets with differentiating products
Widespread adoption of voice assistants such as Google Assistant and Amazon Alexa is spurring burgeoning growth of IoT devices, which were on exhibit throughout the show floors of...
Friday 18 January 2019
Taiwan makers keen to develop auto-use MOSFET, industry IGBT
As international IDMs still dominate the market for IGBT, the core power component for new energy vehicles and hybrid vehicles, Taiwan makers of discrete power devices are keen to...
Thursday 17 January 2019
Taiwan LED makers improving production efficiency in competition with China rivals
Taiwan-based LED firms have been improving their production efficiency by upgrading manufacturing lines with more smart automation equipment in a bid to maintain competitiveness against...
Wednesday 16 January 2019
Weak year ahead for TSMC
Rising chip demand for data centers, AI and IoT applications will still fail to offset the impact of falling demand for Apple's iPhones and other smartphones on 2019 revenues at Taiwan...
Tuesday 15 January 2019
Worldwide semiconductor revenues grow 13% in 2018, says Gartner
Worldwide semiconductor revenues totaled US$476.7 billion in 2018, a 13.4% increase from 2017, according to preliminary results by Gartner. Memory strengthened its position as the...
Monday 14 January 2019
WPG, WT Micro post record 2018 revenues
IC distributors WPG and WT Microelectronics both saw their December revenues register double-digit sequential decreases, but their revenues for all of 2018 still hit record-high le...
Thursday 10 January 2019
Xiaomi keen to tap smart home, IoT markets
After making a magnificent comeback to the smartphone sector and a splashing entrance into smart TV market in 2018, Xiaomi is now keen to tap the emerging smart home and IoT business...
Thursday 10 January 2019
2018 review and 2019 outlook: Heterogeneous chips integration spurs demand for system-3D backend solutions
Heterogeneous integration of diverse semiconductor components to support 5G, AI, automotive electronics, and IoT applications is gaining significant momentum, driving demand for SiP...
Thursday 10 January 2019
Taiwan networking specialists highlight 5G, IoT applications at CES 2019
As part of their efforts to embrace the 5G era, many Taiwan network equipment makers including Sercomm, Zyxel Communications and Wistron NeWeb (WNC) are showcasing the latest 5G and...
Wednesday 9 January 2019
SEMI, Imec team up for healthcare, transportation and IoT
SEMI and Imec are joining forces to drive innovation and deepen industry alignment on technology roadmaps and international standards while adding technology depth to SEMI's five...
Tuesday 8 January 2019
K-Best sets up Super TaiRa Alliance to promote new LPWAN tech
Taiwan-based K-Best Technology, a supplier of RF/microwave equipment, has newly developed an independent low-power wide-area network (LPWAN) wireless communication technology, dubbed...
Friday 28 December 2018
AWS urges enterprises to step up digital transformation with cloud services
Enterprises can leverage external cloud resources to accelerate digital transformation at lower IT cost to boost competitiveness, according to Zhang Xia, Greater China principal enterprise...
Friday 28 December 2018
MLCC firm Holy Stone to expand capacity
Taiwan-based Holy Stone Enterprise is looking to expand production capacity for large-size MLCCs for use in emerging 5G and IoT applications.
Thursday 27 December 2018
China OSAT firms foraying into higher-end packaging fields
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...