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NEWS TAGGED ADVANCED PACKAGING
Thursday 15 February 2024
Samsung embraces hybrid bonding for advanced non-memory packaging
Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor...
Thursday 15 February 2024
OpenAI's trillion-dollar chip plan can end well if right move is made
Nvidia's many customers, including Open AI CEO Sam Altman, are trying to find ways to cut dependency on its AI chips. While specialists have pointed out that Altman's lack of understanding...
Tuesday 6 February 2024
Japan's semiconductor renaissance (2): advanced packaging and materials
The Japanese government's efforts to attract foreign semiconductor investment have been very effective, with almost every major international semiconductor manufacturer responding...
Friday 2 February 2024
OSAT ASEH to boost advanced packaging capability
ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...
Friday 2 February 2024
IC materials distributors gear up for advanced packaging materials demand as customer inventory adjustments end
According to industry sources, IC material distributors anticipate customer inventory adjustments will end in the first half of 2024, with AI expected to accelerate growth in the...
Tuesday 30 January 2024
OSAT providers optimistic and deploying for AI
OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.
Thursday 25 January 2024
Intel opens new advanced packaging fab in New Mexico
Intel has welcomed the opening of Fab 9, a cutting-edge plant in Rio Rancho, New Mexico, a milestone in the company's production of 3D advanced packaging technology on a large scal...
Thursday 25 January 2024
OpenAI refuses to queue for AI chips; will build its fab faster to get them?
OpenAI CEO Sam Altman's plan to build...
Thursday 25 January 2024
APT opens new plant for advanced packaging process solutions
AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan,...
Wednesday 24 January 2024
ASEH, JCET gearing up for AI biz opportunities
OSATs ASE Holdings (ASEH) and Jiangsu Changjiang Electronics Technology (JCET) are both looking to capitalize on the AI market potential.
Wednesday 24 January 2024
TSMC CoWoS capacity expansion to support AI server sales
A significant ramp-up in CoWoS production capacity at TSMC is anticipated to propel server companies' AI server sales to new heights in 2024, according to industry sources.
Tuesday 23 January 2024
TSMC, ASEH gearing up to expand advanced packaging capacity
With TSMC and ASE Holdings (ASEH) gearing up to build additional fab capacities for advanced packaging, relevant supply chain participants are optimistic about growth driven by their...
Friday 19 January 2024
Wah Lee sees strong materials demand for advanced packaging, AI
Materials distributor Wah Lee Industrial is upbeat about demand supporting advanced chip manufacturing and AI applications.
Friday 19 January 2024
Backend houses bullish about advanced packaging demand
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
Thursday 18 January 2024
Advanced packaging continues to boost high-end material demand
According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.