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NEWS TAGGED ADVANCED PACKAGING
Thursday 18 January 2024
IC backend houses expect demand to revive in 2H24
IC backend houses anticipate a resurgence in demand during the latter part of 2024 after a disappointing 2023.
Tuesday 2 January 2024
JCET: China's OSAT industry to experience a mixed situation in 2024, with upturn expected in 2025-26
As Moore's Law slows down, the semiconductor industry is transforming and facing challenges. As a crucial technological segment in the post-Moore era, the role of packaging and testing...
Tuesday 2 January 2024
Dutch chip equipment supplier BE Semiconductor Industries sees soaring 2023 valuation driven by advanced packaging
Marking the beginning of 2024, DIGITIMES Asia compiled the list of the top 100 semiconductor companies based on their market values in dollar terms at the end of 2023. The median...
Wednesday 27 December 2023
A paradigm shift in semiconductor materials development (1)
There are three ways to grow the economic scale in the modern-day semiconductor industry: continuous miniaturization of processes, advanced packaging, and the application of new ma...
Wednesday 27 December 2023
ASE to acquire facilities from subsidiary for packaging capacity expansion
OSAT Advanced Semiconductor Engineering (ASE) will acquire facilities from its fully-owned subsidiary ASE Test to boost packaging capacity, according to the former's parent company,...
Tuesday 26 December 2023
Innolux to launch semiconductor advanced packaging mass-production 2H24
Industry sources indicate that Taiwan-based panel maker Innolux has received orders occupying the entire capacity of its first-phase chip-first advanced fan-out panel level packaging...
Monday 25 December 2023
Could the Qorvo-Luxshare deal threaten to marginalize Taiwanese backend houses from Apple supply chain?
US power amplifier (PA) vendor Qorvo's decision to sell its packaging and testing plants in China to Luxshare Precision Industry, a key Chinese player in Apple's supply chain, has...
Wednesday 20 December 2023
Winbond, PTI team up for 2.5/3D packaging
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
Wednesday 20 December 2023
Taiwan's NSTC offers grants for local heterogeneous integration and advanced packaging EDA tools
The US Defense Advanced Research Projects Agency's (DARPA) 2023 Electronic Resurgence Initiative 2.0 has inspired Taiwan to develop its electronic design automation tools for heterogeneous...
Tuesday 19 December 2023
Why would China send GPUs to Malaysia for advanced packaging?
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
Tuesday 12 December 2023
New Taiwan rule on crucial chipmaking tech presents more opportunities than concerns, says Skytech
Taiwan has issued a list of 22 critical chipmaking technologies not to be revealed to foreign companies; violators will face legal consequences under Taiwan's "National Security Law."...
Thursday 7 December 2023
Pentagon-funded silicon interposer project closer to reshore US advanced packaging capability
The Industrial Base Analysis and Sustainment (IBAS) office, funded by the US Department of Defense to establish high-priority domestic capabilities to safeguard the US defense industrial...
Friday 1 December 2023
Amkor announces US advanced packaging and test facility, Apple to be its first customer
Amkor Technology has announced plans to construct an advanced packaging and test facility in Peoria, Arizona. Amkor expects to invest around US$2 billion and employ approximately...
Friday 1 December 2023
Suppliers optimistic about ABF substrate market in 2024, 2025
Industry suppliers are generally optimistic about Ajinomoto Build-up Film (ABF) substrate market prospects for 2024 and 2025, citing the recovery of the PC market, a growing demand...
Monday 27 November 2023
India's Kaynes SemiCon plans first OSAT line in April, eyes advanced packaging tech partnerships
India's efforts to build a semiconductor manufacturing ecosystem have seen numerous companies enter the semiconductor packaging segment. One of them, Kaynes SemiCon, has revealed...