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NEWS TAGGED ADVANCED PACKAGING
Monday 15 April 2024
Weekly news roundup: JCET has offered advanced packaging services for chips below 5nm, the company says
These are the most-read DIGITIMES Asia stories in the week of April 8 - April 12.
Friday 12 April 2024
China's JCET confirms advanced packaging capability for chips below 5nm
Advanced chip manufacturing and advanced packaging have now become the focus of attention in China. SMIC already confirmed that it had adopted deep ultraviolet (DUV) lithography machines...
Tuesday 9 April 2024
Advanced chips 100% made in US will be possible
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
Monday 8 April 2024
Samsung's advanced packaging reportedly grabs Nvidia orders amid competition with TSMC
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
Tuesday 2 April 2024
TSMC places additional equipment orders for CoWoS packaging
TSMC has placed more equipment orders to boost its CoWoS packaging manufacturing capability, according to sources at fab toolmakers.
Wednesday 27 March 2024
Japan-based suppliers capitalize on emerging glass substrate as chipmakers embrace advanced packaging
As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging tech...
Thursday 21 March 2024
ASE expands VIPack advanced packaging solutions for AI device apps
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...
Thursday 21 March 2024
ASEH acquires land for new factory site in Mexico
Taiwanese OSAT ASE Technology Holding (ASEH) has acquired 37,220 square meters of land in Jalisco, Mexico.
Wednesday 20 March 2024
TSMC Japan 3DIC R&D Center increases partners to meet AI chip solution demand
TSMC Japan 3DIC R&D Center, located at Tsukuba Shi of the Ibaraki Prefecture, is now developing solutions for enlarging AI chip substrates.
Tuesday 19 March 2024
TSMC chooses CoWoS factory site while continuing 3nm capacity expansion
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Tuesday 19 March 2024
TSMC to build two advanced packaging fabs in southern Taiwan
TSMC plans to set up two new advanced packaging fabs in Chiayi, southern Taiwan, a high-ranking Taiwanese government official has announced.
Friday 15 March 2024
Wah Lee returns to growth trajectory as advanced packaging gains traction
Semiconductor material equipment supplier Wah Lee Industrial Group reported a revenue of NT$66.78 billion in 2023, a year-on-year decrease of 9.2%, with a combined after-tax net profit...
Thursday 14 March 2024
APT upbeat about orders for advanced packaging
AblePrint Technology (APT), a company specializing in pneumatic and thermal process solutions for semiconductor packaging, is optimistic about the growing demand for advanced packaging...
Friday 23 February 2024
Intel is grabbing Samsung's cheese with system-level foundry
Samsung beware: As Intel Foundry (IF) is now collaborating with TSMC to accomplish an advanced packaging mission to meet customer's needs, it is aiming for something bigger.
Wednesday 21 February 2024
AI to boost advanced packaging demand
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.