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News tagged Chipbond
  • Last update: Wednesday 18 December 2013 [129 news items]

Chipbond facing increasing competition from rivals in Korea

Dec 18, 14:00

Korea-based Nepes and LB Semcon, providers of LCD driver IC packaging and testing services, have recently cut their quotes by nearly 30% putting Chipbond Technology under pressure,...

Chipbond

VIS, Chipbond October sales rise

Nov 12, 16:08

Specialty IC foundry Vanguard International Semiconductor (VIS) and backend house Chipbond Technology, both of which have more than 50% of their sales generated from the LCD driver...

Chipbond 3Q13 sales slip 3.6%

Oct 15, 15:32

Chipbond Technology, Taiwan's largest LCD driver IC packaging and testing firm, saw its third-quarter revenues decrease 3.6% sequentially bucking seasonal trends.

Chipbond board approves plan for NT$4 billion loan

Stockwatch - Sep 24, 15:39

The board of directors of Chipbond Technology, a Taiwan-based backend house specializing in LCD driver ICs, has approved a plan to apply for a syndicated loan of NT$4 billion (US$135.4...

Chipbond sales to grow up to 5% sequentially in 3Q13

Aug 14, 21:46

LCD driver IC backend service company Chipbond Technology is expected to see its revenues grow moderately within a range of 5% sequentially in the third quarter of 2013 as demand...

Chipbond 3Q13 revenues may fall short of expectations

Jul 19, 15:45

A recent slowdown in demand for small- to medium-size LCD driver ICs, as well as slow adoption of Ultra HD TV sets, might have a negative impact on the sales performance of packaging...

Chipbond ramping up testing capacity for advanced driver ICs

Jun 18, 15:11

Chipbond Technology is ramping up testing capacity for advanced LCD driver ICs in response to rising demand for high-end smartphones and other mobile devices with higher resolution...

Chipbond expects sales to peak in 3Q13

Jun 18, 12:03

LCD driver IC packaging and testing firm Chipbond Technology expects its August and September revenues to reach the highest monthly level for 2013. Revenues for the third quarter...

Demand for large-size driver ICs to boom in 2H13, say backend firms

May 21, 14:47

Packaging and testing firms Chipbond Technology and ChipMOS Technologies both expect orders for large-size LCD driver ICs to pull in during the second half of 2013 on booming demand...

Chipbond, YoungTek to expand LCD driver IC testing capacity in 2Q13

May 10, 16:03

Taiwan-based IC backend service houses Chipbond Technology and YoungTek Electronics plan to ramp up their testing capacity for LCD driver chips by 20% and 30%, respectively, in the...

Chipbond to buy COF substrate supplier

May 2, 22:28

Chipbond Technology has said it will acquire Simpal Electronics, a Taiwan-based COF substrate supplier, through a share swap.

VIS, Chipbond March sales rebound

Apr 11, 14:38

Foundry service provider Vanguard International Semiconductor (VIS) and backend house Chipbond Technology, which generate most of their sales from LCD driver ICs, both saw their monthly...

Chipbond reports record high earnings for 2012

Newswatch - Mar 19, 15:37

LCD driver IC packaging and testing houses Chipbond Technology has reported net profit of NT$2.55 billion (US$85.71 million) for 2012, representing an increase of 43.4% from the year...

Chipbond, ChipMOS 2013 capex to stay flat

Jan 22, 19:58

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.

UMC rolls out thick-plated copper process for PWM ICs

Jan 17, 10:28

United Microelectronics (UMC) has developed a thick-plated copper process, in collaboration with packaging house Chipbond Technology, for power management IC applications.

Chipbond posts record sales in 4Q, 2012

Jan 14, 20:19

Consolidated revenues at Taiwan-based Chipbond Technology, a packaging and testing house specializing in LCD driver ICs, climbed to an all-time high of NT$4.17 billion (US$144.1 million)...

Chipbond to post better-than-expected 4Q12 sales

Dec 6, 15:31

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report an up to 5% sequential increase in consolidated revenues for the fourth quarter of 2012, bucking...

Chipbond posts profit growth on record revenues in 3Q12

Oct 30, 14:42

Chipbond Technology has reported net profits of NT$729 million (US$24.9 million) on consolidated revenues of NT$3.88 billion for the third quarter of 2012. The earnings and sales...

Chipbond 4Q12 sales likely to drop 5%

Oct 18, 22:14

LCD-driver-IC packaging and testing house Chipbond Technology is expected to post a sales drop of about 5% sequentially in the fourth quarter of 2012, compared to the double-digit...

Chipbond 12-inch gold bumping lines to operate at full capacity in September

Sep 11, 16:33

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Aug 21, 01:15

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Chipbond revenues hit two-year high in July 2012

Aug 10, 14:15

LCD driver IC packaging and testing firm Chipbond Technology has announced consolidated revenues of NT$1.27 billion (US$42.3 million) for July 2012 - the highest monthly result since...

Chipbond 3Q12 sales to grow up to 5%

Jul 13, 12:03

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...

ASE, SPIL post sales drops in June

Jul 10, 01:05

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported decreases in June consolidated revenues from the previous month of 1.7% and 5.9%,...

Most backend firms give positive 3Q12 outlook

Jul 4, 01:25

With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.

Chipbond gold bumping capacity booked for iPhones, says report

Newswatch - Jun 29, 12:37

Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...

Chipbond, ChipMOS 2Q12 sales to grow 10%

Jun 25, 15:45

Second-quarter sales at Chipbond Technology and ChipMOS Technologies, two major driver IC packaging and testing houses, are set to register 10% sequential growth driven by brisk demand...

Chipbond sees positive outlook for 2012

Jun 18, 14:54

Chipbond Technology is optimistic about the business prospects for 2012, according to the LCD driver IC packaging and testing specialist. The firm added it would continue to build...

Major Taiwan IC backend firms to post over 5% sales growth in 2Q12

Jun 11, 12:27

Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...

Chipbond lands orders for driver ICs used in new iPhone and Samsung TFT-LCD panels

Jun 5, 01:50

Driver IC packaging testing service provider Chipbond Technology has obtained orders for COG (chip on glass) chips used in screens for a new version of the iPhone, and 8-inch gold...

Chipbond lands 8-inch gold bumping orders from Samsung, says paper

Newswatch - Jun 4, 14:23

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...

Chipbond, ChipMOS 2Q12 sales expected to grow

May 7, 15:41

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...

Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS

Apr 17, 14:55

LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...

Chipbond, ChipMOS see sequential growth in March revenues

Apr 11, 01:25

LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...

SPIL

Chipmore to benefit from more panels produced in China

Apr 3, 14:54

With China adjusting upward its import tariffs for 32-inch and larger LCD panels, the country's self-sufficiency for panels targeted mainly at TVs is expected to rise significantly...

129 items [1/4]
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