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176 news items tagged Chipbond

  • The board of directors of Chipbond Technology, a Taiwan-based backend house specializing in LCD driver ICs, has approved a plan to apply for a syndicated loan of NT$4 billion (US$135.4...
  • LCD driver IC backend service company Chipbond Technology is expected to see its revenues grow moderately within a range of 5% sequentially in the third quarter of 2013 as demand...
  • A recent slowdown in demand for small- to medium-size LCD driver ICs, as well as slow adoption of Ultra HD TV sets, might have a negative impact on the sales performance of packaging...
  • Chipbond Technology is ramping up testing capacity for advanced LCD driver ICs in response to rising demand for high-end smartphones and other mobile devices with higher resolution...
  • LCD driver IC packaging and testing firm Chipbond Technology expects its August and September revenues to reach the highest monthly level for 2013. Revenues for the third quarter...
  • Packaging and testing firms Chipbond Technology and ChipMOS Technologies both expect orders for large-size LCD driver ICs to pull in during the second half of 2013 on booming demand...
  • Taiwan-based IC backend service houses Chipbond Technology and YoungTek Electronics plan to ramp up their testing capacity for LCD driver chips by 20% and 30%, respectively, in the...
  • Chipbond Technology has said it will acquire Simpal Electronics, a Taiwan-based COF substrate supplier, through a share swap.
  • VIS, Chipbond March sales rebound

    Thursday 11 April 2013
    Foundry service provider Vanguard International Semiconductor (VIS) and backend house Chipbond Technology, which generate most of their sales from LCD driver ICs, both saw their monthly...
  • LCD driver IC packaging and testing houses Chipbond Technology has reported net profit of NT$2.55 billion (US$85.71 million) for 2012, representing an increase of 43.4% from the year...
  • LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.
  • United Microelectronics (UMC) has developed a thick-plated copper process, in collaboration with packaging house Chipbond Technology, for power management IC applications.
  • Consolidated revenues at Taiwan-based Chipbond Technology, a packaging and testing house specializing in LCD driver ICs, climbed to an all-time high of NT$4.17 billion (US$144.1 million)...
  • LCD-driver-IC packaging and testing house Chipbond Technology is expected to report an up to 5% sequential increase in consolidated revenues for the fourth quarter of 2012, bucking...
  • Chipbond Technology has reported net profits of NT$729 million (US$24.9 million) on consolidated revenues of NT$3.88 billion for the third quarter of 2012. The earnings and sales...
  • Chipbond 4Q12 sales likely to drop 5%

    Thursday 18 October 2012
    LCD-driver-IC packaging and testing house Chipbond Technology is expected to post a sales drop of about 5% sequentially in the fourth quarter of 2012, compared to the double-digit...
  • LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...
  • Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...
  • LCD driver IC packaging and testing firm Chipbond Technology has announced consolidated revenues of NT$1.27 billion (US$42.3 million) for July 2012 - the highest monthly result since...
  • LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...
  • Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported decreases in June consolidated revenues from the previous month of 1.7% and 5.9%,...
  • With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.
  • Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...
  • Second-quarter sales at Chipbond Technology and ChipMOS Technologies, two major driver IC packaging and testing houses, are set to register 10% sequential growth driven by brisk demand...
  • Chipbond Technology is optimistic about the business prospects for 2012, according to the LCD driver IC packaging and testing specialist. The firm added it would continue to build...
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