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Friday 12 April 2024
Samsung faces first large-scale strike in history amid intensifying global competition
Samsung Electronics is caught in the history of the first collective strike crisis in South Korea amidst intensifying global semiconductor competition. Samsung's five labor unions,...
Friday 12 April 2024
Cadence and Arm come together to drive automotive chiplet ecosystem
Cadence's solution includes a digital twin.
Friday 12 April 2024
No substitute for silicon over next decade, says TSMC SVP
The ongoing booming artificial intelligence (AI) development relies heavily on massive computing power facilitated by semiconductors, and consequently, looking ahead 10 years, there...
Friday 12 April 2024
SK Siltron obtains further US support to accelerate SiC wafer investment
SK Siltron, a silicon carbide (SiC) wafer manufacturer in the United States, is set to receive a US$77 million subsidy from the state of Michigan, following a US$544 million loan...
Friday 12 April 2024
Gudeng to set up new plant in Japan
Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer, plans to open a new facility in Japan. Construction is anticipated to begin in 2024, with...
Friday 12 April 2024
China's JCET confirms advanced packaging capability for chips below 5nm
Advanced chip manufacturing and advanced packaging have now become the focus of attention in China. SMIC already confirmed that it had adopted deep ultraviolet (DUV) lithography machines...
Friday 12 April 2024
South Korea accelerates semiconductor strategy post-Taiwan quake
In the wake of a seismic event rattling Taiwan, and amidst the dawn of the AI era, South Korea's governmental bodies and corporate giants have convened to assess supply chain vulnerabilities...
Friday 12 April 2024
Tokyo Electron to nearly double R&D expenditures over five years
Tokyo Electron plans to ramp up its R&D spending over five years. This move comes as cutting-edge chip manufacturing tools become increasingly vital for the development of next-generation...
Friday 12 April 2024
Intel goal to have half of global advanced chip production in the US and Europe...depends on Asia
As the US seeks to increase its share of production capacity, inviting Asian companies to invest and expand in the US, shifting new wafer fab projects from the Asian continent to...
Thursday 11 April 2024
Global semiconductor equipment billings slip in 2023, says SEMI
Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to US$106.3 billion in 2023, from an all-time high of US$107.6 billion in 2022, according to SEMI.
Thursday 11 April 2024
Research Insight: TSMC's investment in US will bear fruits
DIGITIMES Research analyzed the US CHIPS Act grant program for TSMC and found that although TSMC received US$6.6 billion compared to Intel's US$8.5 billion, the US government still...
Thursday 11 April 2024
Win Win Precision harnesses new energy and semiconductor innovations as growth driver
With new energy and semiconductor components as its two major operating engines, Taiwan's Win Win Precision Technology is looking to advanced light storage and smart energy management...
Thursday 11 April 2024
Tata to host roadshow in Taiwan for talent hiring to accelerate semiconductor ambitions
Tata, committed to setting up a wafer fab and an ATMP facility in India, announced a plan to attract experienced Taiwanese talents to help the new entrant in the semiconductor business...
Thursday 11 April 2024
Nearly 70% of Taiwan's IC output originates from 12-inch foundries
Taiwan's Ministry of Economic Affairs (MOEA) announced on April 8 that the country's IC sector has expanded for 11 straight years from 2012.
Thursday 11 April 2024
ASML to turn a new page as Co-Presidents pass the baton
Coinciding with ASML's 40th anniversary, Martin van den Brink and Peter Wennink, Co-Presidents of Dutch semiconductor equipment manufacturer ASML, are set to retire in...