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NEWS TAGGED PACKAGING
Friday 8 September 2023
IC packaging material suppliers to capitalize on CoWoS surge
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
Thursday 7 September 2023
TSMC expanding CoWoS packaging capacity
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Wednesday 6 September 2023
Innolux subsidiary eyeing entry into semiconductor sector
InnoCare Optoelectronics (INCX), a subsidiary of panel maker Innolux that specializes in the development of flat panels for medical applications, is collaborating with Smart Chain...
Tuesday 5 September 2023
Micron to run HBM packaging hub in Taiwan
Micron Technology has disclosed plans for its Taiwan facility to become the hub of advanced packaging for high bandwidth memory (HBM).
Friday 1 September 2023
Samsung automating semiconductor packaging, doubling efficiency
Samsung Electronics is not only the first company in the world to launch a labor-free semiconductor packaging line, but it has also set a goal of converting its packaging plants to...
Thursday 31 August 2023
To enhance its HBM competitiveness, SK Hynix expands packaging talents internally
The AI boom has fueled the high-performance semiconductor market. SK Hynix, in light of investment reduction, has elected to expand its HBM technology capabilities through recent...
Thursday 31 August 2023
Topco Scientific expands product offerings to CoWoS and 3D IC
Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...
Thursday 24 August 2023
GreenTrans' AMR winning semiconductor packaging and testing customers
Taiwan-based GreenTrans Corporation has expanded the application of its automated guided vehicle (AGV) and autonomous mobile robot (AMR) to the semiconductor sector. The company said...
Wednesday 23 August 2023
Big foundries investing more in advanced packaging
Recent statements by TSMC and Intel regarding their ambitious capital expenditure plans for advanced packaging have raised the bar for incumbent competitors and new entrants alike,...
Wednesday 23 August 2023
Intel to establish advanced packaging fab in Malaysia
Intel has invested a total of US$8 billion in Malaysia, and is committing an additional US$6 billion for the construction of new semiconductor facilities there, including a 3D advanced...
Tuesday 22 August 2023
Advanced packaging capacity to surge 30–40% in 2024, says TrendForce
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Monday 21 August 2023
Alchip raises revenue outlook for 2023
Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has raised its revenue forecast for 2023 from US$800 million to between US$900 million and US$950 million.
Monday 21 August 2023
Semiconductor packaging material suppliers optimistic about EV-generated market growth
The future car market is promising. Automotive suppliers said while the car component supply will keep fluctuating slightly in 2023, the situation will become stable in 2024.
Friday 18 August 2023
Advanced packaging becomes next battlefield for Intel and TSMC
The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.
Thursday 17 August 2023
Taiwan LED firms conservative about 2H23 demand prospects
LED chipmakers and packaging houses, including Ennostar and Everlight Electronics, are conservative about demand during the traditional peak season in the third quarter of 2023.