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NEWS TAGGED PACKAGING
Friday 27 October 2023
Intel expects 4Q23 revenue to return to on-year growth
Intel is optimistic that for the first time in two years, fourth-quarter 2023 revenue will return to positive year-over-year growth, and that the PC market, which accounts for the...
Friday 27 October 2023
IC backend houses see AI chips, CPO stimulate advanced packaging demand
AI chips and co-packaged optics (CPO) will stimulate demand for advanced packaging in 2024, during which the semiconductor industry is expected to rebound.
Thursday 26 October 2023
Substrate-based packaging for chiplet designs gaining popularity
Substrate-based packaging for chiplet designs is gaining favor among AI HPC customers, according to sources at OSATs.
Wednesday 25 October 2023
Faraday expects 4-6% revenue drop in 4Q23
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Wednesday 25 October 2023
WinWay Technology takes the lead in CPO, silicon photonics advanced packaging
High-speed data transmission has come into the spotlight along with cloud-based AI accelerator chips as one of the most vital capabilities in the electronics industry, and silicon...
Wednesday 25 October 2023
AI to boost terminal device replacement
AI will drive demand for PC, handset, and other terminal device replacements, according to sources at chipmakers.
Wednesday 25 October 2023
Chinese OSATs expanding production capacity in Jiangyin
Chinese OSATs such as JCET are expanding their capacity in the city of Jiangyin on China's east coast, according to industry sources. Their expansion focuses on advanced packaging.
Tuesday 24 October 2023
Ansys semiconductor simulation tools certified for UMC WoW advanced packaging
United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency,...
Tuesday 24 October 2023
Equipment supplier C Sun upbeat about advanced packaging demand
Robust demand for CoWoS and other advanced packaging will positively contribute to C Sun Manufacturing's sales operations in the second half of this year, according to the semiconductor...
Thursday 19 October 2023
TSMC expects 11% sequential revenue growth in 4Q23
TSMC expects to post revenues of between US$18.8 billion and US$19.6 billion in the fourth quarter of 2023, which is an 11.1% sequential increase at the midpoint. Gross margin and...
Friday 13 October 2023
Samsung set to roll out HBM4 in 2025 incorporating advanced packaging solution
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
Friday 13 October 2023
Packaging materials demand decelerates
Packaging materials suppliers have seen customers slow down their pace of orders in the fourth quarter, and may encounter a decline in revenue compared to the previous quarter, according...
Friday 13 October 2023
Chinese packaging companies launch 4th round of price hikes amidst decline in LED profits
With market demand weak, LED manufacturers in both Taiwan and China are facing declines in revenue and profits in 2023. Although Chinese LED makers started to initiate price hikes...
Friday 13 October 2023
Amkor opens new factory in Vietnam
Amkor Technology recently inaugurated its newest manufacturing facility in Bac Ninh, Vietnam.
Wednesday 11 October 2023
TSMC to maintain 2023 outlook despite stronger 3Q
Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...