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STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing

Press release; Jessie Shen, DIGITIMES Asia Wednesday 15 September 2010 0

STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based chip packager introduced 300mm eWLB wafer manufacturing capabilities in...

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