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STATS ChipPAC fan-out wafer-level packaging shipments exceed 1 billion units

Press release; Jessie Shen, DIGITIMES Asia Wednesday 11 May 2016 0

STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company.

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