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SPIL gearing up for fan-out WLP

Patty Wang, Taipei; Jessie Shen, DIGITIMES Asia Thursday 29 January 2015 0

Siliconware Precision Industries' (SPIL) fan-out type wafer level packaging (WLP) will be ready for mass production in 2016, company chairman Bough Lin said during a January 28 investors conference.

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