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TSMC to offer InFO packaging for 16nm chips in 2016, says paper

EDN; Jessie Shen, DIGITIMES Asia Friday 21 November 2014 0

Taiwan Semiconductor Manufacturing Company (TSMC) will be able to offer its backend InFO (integrated fan-out) wafer-level packaging process for 16nm chips as soon as 2016, the Chinese-language Economic Daily News (EDN) cited market watchers...

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