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TSMC to offer InFO-WLP technology for 16nm chips, eyeing Apple orders

Josephine Lien, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 4 February 2015 0

Taiwan Semiconductor Manufacturing Company (TSMC) will have its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology ready for 16nm chips, eyeing orders for Apple's A10 processors, according to industry sources.

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