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TSMC advanced packaging seen crucial for HPC chips

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Tuesday 3 April 2018 0

The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major advanced wafer-level packaging technologies badly needed in the AI...

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