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Taiwan OSAT firms keen to develop FOPLP with good yield rate

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Monday 21 May 2018 0

Lagging behind Taiwan Semiconductor Manufacturing Company (TSMC) in the development of fan-out wafer level packaging (FOWLP) technology, Taiwan's main OSAT (outsourced semiconductor assembly and test) firms such as Powertech Technology and Advanced...

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