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Cadence offers design tools for TSMC InFO packaging

Press release; Jessie Shen, DIGITIMES Asia Wednesday 23 September 2015 0

Cadence Design Systems has announced that its Allegro system-in-package (SiP) and physical verification system (PVS) implementation technologies have been enabled for TSMC's integrated fan-out (InFO) packaging technology. By providing an integrated...

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