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STATS ChipPAC intros new 3D eWLB PoP solutions

Press release; Jessie Shen, DIGITIMES Asia Wednesday 7 March 2012 0

STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package (PoP) solutions. The new 3D technology provides an ultra...

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