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STATS ChipPAC completes expansion of 300mm wafer bump and WLCSP operation in Taiwan

Press release; Jessie Shen, DIGITIMES Asia Thursday 17 November 2011 0

STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.

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