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Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Monday 21 November 2011 0

Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that require components with a certain level of integration, company CEO...

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