STATS ChipPAC reaches milestone of over 300 million copper wirebond units shipped

Jessie Shen, DIGITIMES, Taipei Wednesday 4 May 2011 0

STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100 million semiconductor packages with copper wirebond interconnect was...

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