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ASE sees 7-9% growth in 2Q11 shipments; copper wire bonding sales rising

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Monday 2 May 2011 0

Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph Tung said at a recent investors meeting.

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