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Copper pillar to be mainstream FC packaging technology in 2012

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Friday 3 June 2011 0

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC) packaging technology dubbed copper pillar bumping, according to industry...

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