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Spreadtrum adopts STATS ChipPAC eWLB packaging for smartphone ICs

Jessie Shen, DIGITIMES, Taipei Thursday 24 January 2013 0

Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones sold in China, according to the Singapore-based IC packaging and testing...

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