Home Tech Semiconductors

STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model

Josephine Lien, Taipei; Steve Shen, DIGITIMES Asia Tuesday 29 January 2013 0

STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.

The article requires paid subscription. Subscribe Now

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS