STATS ChipPAC delivers ultra thin PoP solutions with eWLB packaging

Press release; Jessie Shen, DIGITIMES Asia Tuesday 20 August 2013 0

STATS ChipPAC has announced it has reduced package-on-package (PoP) height with its ultra thin embedded wafer level ball grid array (eWLB) technology. The eWLB-based PoP solutions come with an ultra thin package profile height of 0.3mm.

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