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Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 7 September 2011 0

Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for copper wire is expected to increase form 11% in 2010 to more than 20%...

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