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ASE and SPIL look to continued growth in copper wire bonding business in 3Q11

Ingrid Lee, Taipei; Steve Shen, DIGITIMES Asia Monday 15 August 2011 0

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase substantially in the third quarter of 2011 as more clients have...

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