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Chipbond sees positive outlook for 2012

Mavis Hong, Taipei; Jessie Shen, DIGITIMES Asia Monday 18 June 2012 0

Chipbond Technology is optimistic about the business prospects for 2012, according to the LCD driver IC packaging and testing specialist. The firm added it would continue to build new capacity this year with a focus on 12-inch bumping and wafer-level...

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