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TSMC to double CoWoS capacity in 2025; Nvidia will use 60%

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Drone developer Thunder Tiger eyes strategic tie with NextVision

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HBM memory supply to scale in 2025

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China solar energy market remains plagued by low prices

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Despite start of new AI server shipments, server ODMs see gross margins fall

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Server component providers welcome new era with Nvidia GB200 mass production

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PCB and CCL firms gearing up for AI server boom

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GB200 peripheral chip suppliers delighted with Blackwell cooling issues addressed

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First Dimensity 9400 AI mobile phone debut; Vivo expects X200 sales to treble

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Home Tech Communications

Taiwan handset ODMs to perform differently in 2015

Daniel Shen, Taipei; Steve Shen, DIGITIMES Asia Wednesday 4 February 2015 0

Taiwan-based handset ODMs Compal Electronics and Inventec are set to ramp their shipments in 2015 after the consolidation of their associated companies Compal Communications and Inventec Appliances, while Arima Communications may see its shipments decline...

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SK Hynix starts mass production of world's first 321-high NAND

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