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Spreadtrum ready to roll out 1Xnm mobile chips in 2016, says CEO

Cage Chao, Taipei; Jessie Shen, DIGITIMES Asia Monday 16 November 2015 0

China's Spreadtrum Communications is looking to boost its handset-chip shipments in 2015, and is set to roll out its next-generation chips built using 14/16nm FinFET technologies in 2016, according to company chairman and CEO Leo Li.

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