Since the elimination of lead (Pb) from most solders in the last 20 years, new challenges for solder and electronics assembly have arisen, as solder has been redefined by its evolving applications in a wide variety of electronics assembly markets.
Indium Corporation, the global leader for high-reliability solders, recently partnered with 3S Silicon Tech Incorporated, to provide a technology forum featuring technical discussions on Achieving Solder Joint Reliability for Automotive Applications. The event took place at Sheraton Hsinchu Hotel in ZhuBei city, Taiwan, on August 11, 2017.
At the event, technical experts from both companies detailed high-reliability technology and materials for automotive applications, including alloys and low-temperature solders, reliable materials for system-in-package (SiP) applications, power semiconductor development and applications in the automotive market, and vacuum oven reflow technology and applications.
Dr. Ning-Cheng Lee, Indium Corporation Vice President of Technology, shared detailed information on how high-reliability soldering alloys and low-temperature solder paste can be used for module and SiP applications.
SiP technology combines various components or chips into one silicon module. This unique technology has the advantages of high-performance and lower manufacturing costs. SiP modules are being adopted by electronics and automotive industries at an increasing rate, especially for use in infotainment systems.
Key elements of Dr. Lee's presentation included recent developments by Indium Corporation's Research and Development team. The developments discussed included:
- High-reliability alloys, which perform better than SAC for automotive applications, enable reliable solder interconnect when thermal cycling up to 150 degree C. Indium Corporation's Indalloy 276 and Indalloy 271 deliver this solution.
- Low-temperature alloy Sn20In2.8Ag can be used to reduce thermal stress and warpage issues for assembly.
- Indium Corporation provides a variety of high-temperature Pb-free offerings for power semiconductor die-attach in the form of silver- (Ag) and copper- (Cu) sintering pastes, as well as the standard HTPbF solder pastes, BiAgX and HT-BiAgX.
Reliability, along with high thermal and electrical conductivity are major concerns for automotive electronics. With the increasing use of powerful motors in electric vehicles, the need for high-reliability, especially under extreme-temperature thermal cycling and high-temperature operation, is more critical than ever. The automotive industry requires a Pb-free solder paste that can achieve high reliability while also meeting the fine-feature printing circuit board requirements needed by mobile device manufacturers.
Dr. Lee's insights explained how silver-sintering materials applied in the final joint as low-porosity, pressureless sintering of nano-Ag solder for high-temperature semiconductor die-attach can significantly reduce thermal fatigue stress and also produce very low-voiding results. This technology is also beneficial for high-temperatures and electrical conductivity. Dr. Lee also provided a view into low-temperature solder material development.
Through this seminar, it is clear that Indium Corporation is in the forefront of R&D technology as it seeks to produce advanced materials that achieve the reliability requirements of the automotive industry.
Dr. Ning-Cheng Lee, Vice President of Indium Corporation, talks about high reliable soldering alloys and low temperature solder paste for SiP packaging.
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