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TSMC to double CoWoS capacity in 2025; Nvidia will use 60%

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Drone developer Thunder Tiger eyes strategic tie with NextVision

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HBM memory supply to scale in 2025

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China solar energy market remains plagued by low prices

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Despite start of new AI server shipments, server ODMs see gross margins fall

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Server component providers welcome new era with Nvidia GB200 mass production

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PCB and CCL firms gearing up for AI server boom

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GB200 peripheral chip suppliers delighted with Blackwell cooling issues addressed

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First Dimensity 9400 AI mobile phone debut; Vivo expects X200 sales to treble

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Home Tech Semiconductors

ASE, SPIL reschedule stock swap for October 2018

Julian Ho, Taipei; Adam Hwang, DIGITIMES Asia Monday 18 December 2017 0

IC packaging and testing service providers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have decided to defer the long stop date for share exchange from December 31, 2017 to October 31, 2018 beause their plan...

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SK Hynix starts mass production of world's first 321-high NAND

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