Indium Corporation will feature its proven Indium3.2HF Solder Paste for LED manufacturing at Touch Taiwan Display International, August 28-30 in Taipei, Taiwan.
The use of high-power LEDs, MicroLEDs, and MiniLEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials. Indium Corporation's Indium3.2HF Solder Paste provides:
• Consistent printing performance
• Long stencil life
• Outstanding slump resistance
• Excellent wetting ability
• Superior fine-pitch soldering ability
• Water-washable flux residue
Indium Corporation also provides a myriad of materials for LED manufacturing, such as IndiTri or indium trichloride for manufacturing common MOCVD precursor materials, metal-based thermal interface materials (TIMs), gold-tin solder preforms and pastes, and ultra-low voiding solder pastes.
See Indium Corporation's experts at the show or visit www.indium.com/LED to learn more.
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