中文網
Taipei
Mon, Nov 29, 2021
11:14
mostly cloudy
23°C
CONNECT WITH US

BT substrate demand for wire-bonding, memory chips to stay strong till 1Q22

Jay Liu, Taipei; Willis Ke, DIGITIMES 0

BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset APs and AiP modules may see strong demand last longer, according...

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories