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BT substrate demand for wire-bonding, memory chips to stay strong till 1Q22

Jay Liu, Taipei; Willis Ke, DIGITIMES Asia Monday 30 August 2021 0

BT substrates for wire-bonding use or memory chips processing are expected to stay in robust demand till at least the first quarter of 2022, and those for processing higher-end handset APs and AiP modules may see strong demand last longer, according...

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