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TSMC to move CoWoS-L technology to commercial production in 2 years

Julian Ho, Taipei; Jessie Shen, DIGITIMES 0

Credit: DIGITIMES

TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target AI-specific training chips.

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