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ASE competing with leading foundries, IDMs in advanced packaging segment

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 26 April 2022 0

Credit: DIGITIMES

With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in the segment where OSE ASE Technology will be competing against TSMC,...

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