Panram International, a memory module contract manufacturer, has announced the layoff of approximately half its employees. The primary cause is the cancellation of OEM orders from...
Orient Semiconductor Electronics (OSE), a provider of backend and electronics manufacturing services (EMS), is experiencing strong demand for AI servers and is expected to receive...
NAND flash controller manufacturer Phison Electronics has announced the successful implementation of its aiDAPTIV+ AOI service into the automated optical inspection (AOI) systems...
Orient Semiconductor Electronics, Ltd.(OSE), a matured logic IC and NAND Flash memory semiconductor packaging & testing service and electronic manufacturing service (EMS) provider,...
Several Taiwan-based OSATs, including ChipMOS Technologies, Lingsen Precision Industries, Orient Semiconductor Electronics (OSE), and Walton Advanced Engineering, have begun to see...
Memory backend specialists including Powertech Technology (PTI), ChipMOS Technologies and Orient Semiconductor Electronics (OSE) have received an influx of short lead-time orders...
As inventory adjustments at semiconductor and electronics supply chains may persist into the fourth quarter of the year, many medium-sized OSATs are seeking different niches to bolster...
Memory makers such as Micron Technology and Kioxia are expected to see their business operations undermined by sharp declines in end-market demand for consumer electronics devices...
ASE Technology Holding (ASEH), which operates its backend operations mainly in Kaohsiung, southern Taiwan, will see its fab utilization rates loosen slightly in the fourth quarter...
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor...
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
