Demand for wire-bonding packaging is likely to slow down in 2022 as backend houses have decided to defer installation of new wire-bonders that have reached them following long delivery...

Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...

Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...

Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.

Shortages of automotive MOSFET and power management ICs are getting worse as many IDMs including Infinenon and On-Semi are operating at reduced capacity at their plants in Malaysia,...

Backend houses have seen their delivery lead times for MCUs, audio ICs, USB interface ICs and power management chips extend all the way to as long as two months from the previous...

Taiwan's second-tier IC backend houses are set to embrace brisker business results for the second half of the year thanks to a significant surge in customer orders, after posting...

Taiwan backend houses have seen clear order visibility for wire-bonding packaging services for notebook- and PC-use peripheral chips throughout 2021, while continuing to embrace strong...

Taiwan's backend capacity supply is being further constrained by COVID cluster infections at some OSATs including King Yuan Electronics (KYEC) and Greatek Electronics.

Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...

The ongoing coronavirus-induced stay-at-home activities have continued to spur demand for semiconductor and IC parts in 2021, buoying sales at many Taiwan-based chipmakers, including...

Backend demand for display peripheral ICs, such as T-Con and TDDI chips, has been robust, and major OSATs such as ASE Technology and Greatek Electronics are busy processing such chips...

Backend house ChipMOS Technologies will expand production capacity for memory chips by 30-40% in 2021 to meet strong demand from major memory module makers in Taiwan, according to...

Taiwan's backend houses are relatively conservative about capex expansions, compared to foundry houses and fabless firms' eagerness in inceasing spending, according to industry sou...

The supply of IC packaging production tools including polish grinders, wafer-dicing machines, and tape laminators has become severely tight, apart from delivery lead times lengthened...