IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Major memory probe card vendors in the US and Japan have seen a surge in demand from DRAM suppliers, with delivery lead times for their orders already extended to around 20 weeks...
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...
As Taiwan's OSAT output value is estimated to hit another record high in 2021, domestic equipment and materials suppliers are poised to embrace robust demand from the sector, according...
With demand for diverse chips solutions continuing to grow robustly, Taiwan's foundry houses, IC designers and even EMS providers are all strengthening tie-up with backend houses...
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
Taiwan-based backend houses have seen strong demand for display driver ICs and NAND flash controller chips, with clear order visibility through the second quarter of 2021, according...
Taiwan backend houses will continue to embrace orders shifted by chipmakers from Chinese peers, as "risk control" has become a major concern among global chipmakers now that the US...
Taiwan's backend house Chipbond Technology has disclosed plans to build additional testing capacity to satisfy robust demand for display driver ICs, RF and PA components.
The US Department of Commerce reportedly will place another 89 Chinese tech firms on its MEU (military end user) control list including JCET's subsidiary STATS ChipPAC and IC distributor...
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
