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Thursday 22 April 2021
ChipMOS to expand backend capacity for memory chips
Backend house ChipMOS Technologies will expand production capacity for memory chips by 30-40% in 2021 to meet strong demand from major memory module makers in Taiwan, according to...
Monday 19 April 2021
Capacity utilization, expansion for mature processes now top concern for OSATs
Taiwan's backend houses are relatively conservative about capex expansions, compared to foundry houses and fabless firms' eagerness in inceasing spending, according to industry sou...
Wednesday 14 April 2021
IC packaging equipment in severely tight supply
The supply of IC packaging production tools including polish grinders, wafer-dicing machines, and tape laminators has become severely tight, apart from delivery lead times lengthened...
Thursday 8 April 2021
Backend firms see persistently strong demand for MCUs
Backend firms including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE) continue to enjoy strong packaging demand for...
Wednesday 24 March 2021
Wire-bonding capacity to sustain full utilization throughout 2021
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
Tuesday 16 March 2021
Backend firms to gain growth momentum from car chips till 3Q21
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Friday 12 March 2021
DRAM probe card demand ramping up
Major memory probe card vendors in the US and Japan have seen a surge in demand from DRAM suppliers, with delivery lead times for their orders already extended to around 20 weeks...
Wednesday 3 March 2021
BGA packaging for memory controller ICs hits snag on ABF substrate shortages
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Wednesday 17 February 2021
Backend houses to thrive on strong demand for 5G, Wi-Fi 6 chips in 2021
Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...
Tuesday 12 January 2021
Equipment makers eyeing strong demand from Taiwan OSAT firms
As Taiwan's OSAT output value is estimated to hit another record high in 2021, domestic equipment and materials suppliers are poised to embrace robust demand from the sector, according...
Monday 11 January 2021
IC foundries, designers strengthening tie-up with backend houses
With demand for diverse chips solutions continuing to grow robustly, Taiwan's foundry houses, IC designers and even EMS providers are all strengthening tie-up with backend houses...
Thursday 7 January 2021
OSE seeking logic chips backend orders after allying with Chipbond
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Tuesday 22 December 2020
Taiwan OSAT firms see clear order visibility through mid-2021
Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
Wednesday 16 December 2020
Backend firms see strong demand for DDI, NAND controller chips
Taiwan-based backend houses have seen strong demand for display driver ICs and NAND flash controller chips, with clear order visibility through the second quarter of 2021, according...
Monday 7 December 2020
Taiwan backend houses see orders boom
Taiwan backend houses will continue to embrace orders shifted by chipmakers from Chinese peers, as "risk control" has become a major concern among global chipmakers now that the US...