Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane, the highest UCIe speed, for AI/HPC/xPU/Networking applications. UCIe 32G chiplet interface provides an industry-leading bandwidth density 10Tbps per 1mm of die edge (5Tbps/mm full duplex). The chip uses TSMC's N3P silicon process and CoWoSR advanced packaging technology.
In recent years GUC has developed a family of chiplet interconnect IPs (GLink-2.5D) in TSMC N7, N5, and N3 process nodes. GLink-2.5D IPs were validated in silicon demonstrating robust operation up to 17.2 Gbps with raw BER
The UCIe Consortium has set a vision for the interoperability of chiplet interfaces. GUC's implementation of UCIe takes advantage of many silicon-proven generations of GLink-2.5D IPs, making the lowest risk path to UCIe with the highest performance parameters. GUC also developed bridges for AXI, CXS, and CHI buses using the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low power, low data transfer latency, and efficient end-to-end flow control, facilitating a seamless transition from single-chip NoC to chiplets architecture. The bridges support Dynamic Voltage and Frequency Scaling (DVFS) allowing voltage and bus frequency change on the fly while ensuring uninterrupted data flow.
GUC's UCIe IP supports UCIe-1.1 Preventive Monitoring functionality. It includes proteanTecs' I/O signal quality monitors which were already tested in the GLink-2.5D family. Signal quality is monitored in mission mode, during data transfer, without retraining or causing any data transfer interruption. Every signal lane is continuously monitored and reported separately, and power and signal integrity events are detected. Bumps and trace defects are identified before they cause the interface to fail. The repair algorithm then replaces marginal lanes- with redundant ones to prevent system operation failure, so the chip lifetime is extended.
"We are proud to announce the world's first UCIe IP supporting 32 Gbps," said Aditya Raina, CMO of GUC. "We have established a complete silicon-proven 2.5D/3D chiplet IP portfolio at TSMC's 7nm, 5nm, and 3nm technologies. Together with design expertise, package design, electrical and thermal simulations, DFT, and production testing for the TSMC 3DFabric offerings including CoWoS, InFO, and SoIC, we provide our customers with a robust and comprehensive solution, enabling fast design cycles and quick bring-up of their AI/HPC/xPU/Networking products."
"We are committed to delivering the fastest and the lowest power 2.5D/3D chiplets and HBM interface IPs," said Igor Elkanovich, CTO of GUC. "Convergence of 2.5D and 3D packaging using HBM3/4, GLink-2.5D/UCIe and GLink-3D interfaces enables highly modular, much bigger than reticle size processors of the future."
To learn more about GUC's UCIe IP portfolio, and CoWoS/3DIC total solution, please contact your GUC sales representative directly or email guc_sales@guc-asic.com.
GUC UCIe Highlights