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Former TSMC executive set to depart Samsung after two years as advanced packaging division restructures

Monica Chen, Hsinchu; Jack Wu, DIGITIMES Asia Monday 26 August 2024 0

Credit: AFP

In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng "Vic" Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders indicate that this task force has recently been disbanded. There...

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