During the 25th Taiwan Circuit Board Industry International Exhibition 2024 at the Taipei Nangang Exhibition Center from 23-25 October 2024, we had the pleasure of meeting and interviewing Dr. John T.C. Lee, President and CEO of MKS Instruments, a global provider of enabling technologies that are transforming the world's semiconductor, advanced packaging and industrial markets.
Today, MKS Instruments combines leading capabilities in lasers, optics, motion, process chemistry, and equipment. The company has recently installed the latest equipment and process technology at its local APAC Technology Centres to drive the production of next-generation packaging substrates and offer customers and OEMs faster development cycles for new products and materials, enabling high-end SAP technology requiring <=5/5µm lines and spaces.
John T.C. Lee announced plans to build a new Super Centre facility in Penang, Malaysia to support wafer fabrication equipment production in the region and globally. The company also plans to open a TechCentre and manufacturing facility in Samut Prakan, near Bangkok, Thailand to serve the growing printed circuit board and package substrate industries in Southeast Asia, particularly Thailand.