In the post-Terry Gou era, Foxconn has elected a new chairman, Young Liu, who has been leading the semiconductor business subgroup of the electronics manufacturing giant. Liu's rise to the leadership post highlights Foxconn's semiconductor drive to raise self-sufficiency. Meanwhile, the trade war with the US must have fueled China's desire to improve its semiconductor self-sufficiency, but the easing of the tensions between the two superpowers after the recent G20 summit has been positive news for many in the supply chain, with MOSFET and other chip demand for PCs, notebooks and consumer electronics devices expected to pick up in the second half of 2019.
Foxconn set to build 12-inch wafer fab in 2020 as IDM: Foxconn Technology Group is likely to kick off construction of a 12-inch wafer fab in 2020 in Zhuhai, southern China in cooperation with the city government there, and will operate the plant as an IDM to satisfy the group's own demand for 8K, 5G and AI chip solutions, according to industry sources.
Taiwan MOSFET firms see sales pick up: Taiwan-based MOSFET chip specialists, which ship mainly for PC and notebook applications, may have seen their sales hit bottom for 2019 in April and May. Sales have started picking up, and are expected to grow through the second half of the year, according to industry sources.
