CONNECT WITH US

Joint venture between Toyota and Denso to participate in diamond power semiconductor R&D

Chiang, Jen-Chieh, Taipei; Jack Wu, DIGITIMES Asia 0

Japanese precision component manufacturer Orbray announced that it has signed a contract with automotive semiconductor R&D corporation Mirise Technologies to conduct R&D on diamond power semiconductors. In addition, Orbay also stated that it...

The article requires paid subscription. Subscribe Now