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US govt commits US$1.4 billion to domestic chip packaging

Ollie Chang, Taipei; Elaine Chen, DIGITIMES Asia Friday 17 January 2025 0

Credit: DIGITIMES

The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards to strengthen US leadership in advanced packaging. This funding will...

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